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2014-07-17 08:34:15

TAIPEI, July 17, 2014 /PRNewswire/ -- Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company") today announced that it has priced an offering of US$300 million aggregate principal amount of guaranteed bonds due 2017 offered by Anstock II Limited, its wholly owned subsidiary (the "Bonds"). The Bonds are unconditionally and irrevocably guaranteed by ASE. The proceeds will be used to fund certain eligible projects to promote the Company's transition...

2014-07-15 23:03:24

Park Systems, a leading manufacturer of atomic force microscopy (AFM) products announces Park NX-Wafer, a revolutionary AFM design for bare wafer manufacturing that fully automates the defect review process and increases production throughput by an astounding 1,000%. Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry. Santa...

2014-07-14 23:04:42

APAC held a major share of the power electronics ecosystem, worth 42.11%, in 2013; it is expected to be at the same position across the forecast period, followed by the Americas and Europe. (PRWEB) July 14, 2014 According to a new market research report "Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography - Analysis & Forecast to 2014 - 2020", the Power Electronics...

2014-07-10 23:04:59

ChinaMarketResearchReports.com adds latest report on “Global and China IC Substrate Industry Report, 2014-2015” to its store. Dallas, TX (PRWEB) July 10, 2014 PCB (printed circuit board) industry can be divided into three broad categories i.e. rigid PCB, flexible PCB (FPCB) and substrate. IC substrate industry suffered a continuous decline in 2012 and 2013, rooted in two aspects: first, the PC shipment declined, and CPU substrate as the main type of IC substrate enjoyed the highest...

2014-07-07 08:30:45

MIGDAL HAEMEK, Israel, July 7, 2014 /PRNewswire/ -- Jordan Valley Semiconductors [http://www.jordanvalley.com ] Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that it has recently delivered and successfully commissioned its JVX7300L in-line X-ray metrology tool at multiple customers. The systems have been purchased for in-fab process development and automated production monitoring of GaN on Si wafers....

2014-07-04 23:02:40

The market report is a culmination of an extensive primary and secondary research that provides the current size of the market (both in terms of the shipments and market revenue) and also forecasts the same for the period from 2014 to 2020. (PRWEB) July 04, 2014 According to a new market research report, "Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography - Analysis &...

2014-07-03 12:27:55

MIGDAL HAEMEK, Israel, July 3, 2014 /PRNewswire/ -- Jordan Valley Semiconductors Ltd. [http://www.jordanvalley.com [https://webmail.jvsemi.com/exchweb/bin/redir.asp?URL=http://www.jordanvalley.com ]], a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (microXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by...

2014-07-02 08:22:49

- Up to 0.25% efficiency gains demonstrated on 110 ohms/sq. monocrystalline wafers WEST CONSHOHOCKEN, Pa., July 2, 2014 /PRNewswire/ -- The Heraeus Photovoltaics Business Unit will feature two new front-side metallization pastes for c-Si solar cells during the Intersolar North America 2014 at the Moscone Center in San Francisco, California on level 1 in Booth 7611 from July 8(th) through 10(th). The SOL9620 Series and SOL9621 Series represent Heraeus' latest pastes that enable cell...

2014-06-30 08:37:09

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput ST. FLORIAN, Austria, June 30, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI(®)FB XT--its next-generation fusion wafer bonding platform, which combines several performance...

2014-06-25 08:24:42

DUBLIN, June 25, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/6pbpzk/gallium_nitride) has announced the addition of the "2014 Report on the International Gallium Nitride (GaN) Semiconductor Devices (Discrete & IC) and Substrate Wafer Market - Forecast to 2022" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 This report concerning the GaN device and wafer market identifies the entire market and all its sub-segments...


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