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2014-10-13 20:22:22

LONDON, Oct. 13, 2014 /PRNewswire/ -- Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today. WLP offers lower cost, a smaller package, higher performance and added functionality compared to older methods....

2014-10-09 16:29:47

DALLAS, October 9, 2014 /PRNewswire/ -- The wafer foundry market experienced a wavy development, jumping by 39.4% in 2010 following a 7.9% decline in 2009. And the growth rate first shrank to 8.7% in 2011, then expanded to 21.7% in 2012, and fell back to 6.8% in 2013. It is projected that the growth rate will stand at 15.6% in 2014 and 6.0% in 2015. The fluctuation in the wafer foundry market will begin to present an increasingly small growth rate, which is mainly because of...

2014-10-06 08:35:23

EVG®580 ComBond® integrates advanced surface preparation processing to ensure oxide-free bonds and higher device yields ST. FLORIAN, Austria, Oct. 6, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG(®)580 ComBond(®)?a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature. Built on a modular...

2014-10-01 23:04:23

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC technology. San Jose, CA (PRWEB) October 01, 2014 MonolithIC 3D Inc., the technology innovator of monolithic 3D, announced today that it will unveil a game changing process flow for monolithic 3D (M3DI) using existing fab and existing transistor processes at the IEEE S3S Conference 2014. On October 9th afternoon, at the Westin San Francisco Airport, Zvi...

2014-10-01 16:28:55

PHOENIX, Oct. 1, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250(th) Multi-Product Wafer Bump design since January 2013. http://photos.prnewswire.com/prnvar/20120306/LA64593LOGO-a Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test...

2014-10-01 08:24:12

TEMPE, Ariz., Oct. 1, 2014 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced its solar subsidiary, Tempress Systems, has received the second field acceptance of its PECVD production tools as part of Mission Solar Energy's 100MW cell line in San Antonio, Texas, implementing next generation, high efficiency...

2014-09-23 20:21:03

TEMPE, Ariz., Sept. 23, 2014 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced its solar subsidiary, Tempress Systems, has received field acceptance of its PECVD production tools from a leading Asian solar cell and panel manufacturer. Mr. Fokko Pentinga, Chief Executive Officer of Amtech, commented, "We...

2014-09-22 12:22:38

DUBLIN, Sept. 22, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "Global Silicon on Insulator (BESOI, ELTRAN, SOS, SIMOX and Smart-Cut) Market - Forecast to 2020" report to their offering. http://photos.prnewswire.com/prnvar/20130307/600769 The term Silicon on Insulator' was first introduced by IBM in August 1998. The potential benefits from technologies associated with the Silicon on Insulator (SOI) lies in the intersection of multiple capabilities. With new...

2014-09-21 20:20:30

Fokko Pentinga, CEO, to Speak in Opening Session on Monday, September 22, 2014 TEMPE, Ariz., Sept. 21, 2014 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced that Amtech's solar subsidiary, Tempress Systems, will exhibit at the 29(th) European PV Solar Energy Conference and Exhibition (EU PVSEC 2014)...

2014-09-19 23:05:20

Semiconductor & IC Packaging Materials Market report estimates the market size of the semiconductor packaging materials market in terms of revenue, regionally, and in end-user markets.(http://www.marketsandmarkets.com/Market-Reports/semiconductor-ic-packaging-materials-market-31363123.html) (PRWEB) September 19, 2014 The report defines and segments the "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages,...


Word of the Day
ween
  • To think; to imagine; to fancy.
  • To be of opinion; have the notion; think; imagine; suppose.
The word 'ween' comes from Middle English wene, from Old English wēn, wēna ("hope, weening, expectation"), from Proto-Germanic *wēniz, *wēnōn (“hope, expectation”), from Proto-Indo-European *wen- (“to strive, love, want, reach, win”).
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