Latest Wafer Stories

SHANGHAI, March 16, 2012 /PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 0981.HK), China's largest and most advanced semiconductor foundry, is pleased to announce that its subsidiary, Semiconductor Manufacturing International (Beijing) Corporation, has closed a seven-year syndicated loan in the amount of USD 600 million today, from a consortium of banks led by the China Development Bank and the Export-Import Bank of China. The...

JIASHAN, China, March 16, 2012 /PRNewswire-Asia/ -- ReneSola Ltd ("ReneSola" or the "Company") (NYSE: SOL), a leading global manufacturer of solar wafers and provider of solar modules, today announced its unaudited financial results for the fourth quarter and full year ended December 31, 2011. (Logo: http://photos.prnewswire.com/prnh/20080506/CNTU030 ) Fourth Quarter 2011 Financial and Operating Highlights Total solar wafer and module shipments in Q4 2011 were 339.9...

ST. FLORIAN, Austria and TOKYO, March 14, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials. Shin-Etsu's advanced adhesives will be qualified with EVG's EZR® (Edge Zone Release) and...

SHANGHAI, March 14, 2012 /PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK), China's largest and most advanced semiconductor foundry, Brite Semiconductor (Shanghai) Corporation ("Brite"), a leading IC design and turnkey service provider, and Zhejiang University IC and Basic Software Research Institute ("Zhejiang University") today announced the founding of a joint IC research program. The IC research program will provide a...

SHANGHAI, March 8, 2012 /PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK), China's largest and most advanced semiconductor foundry, today announced an ultra high density (UHD) library solution for its 0.11um Cu-BEoL (Copper Back End of Line) manufacturing platform that can reduce chip size by an average of 31%. SMIC's comprehensive silicon-proven UHD IP solution incorporates SMIC's in-house UHD IP library, based on...

PHOENIX and PORTO, Portugal, March 6, 2012 /PRNewswire/ -- FlipChip International (FCI), the global technology leader in flipchip bumping and Wafer Level Packaging, and NANIUM S.A. (NANIUM), a world-class provider of manufacturing, test and engineering services in the semiconductor business, announced today License, Sales and Marketing agreements for 300mm flipchip bumping and Wafer Level Packaging. (Logo: http://photos.prnewswire.com/prnh/20120306/LA64593LOGO-a) (Logo:...

TOKYO, March 1, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech). The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs. Specifically,...

LEHIGH VALLEY, Pa., March 1, 2012 /PRNewswire/ -- Air Products (NYSE: APD) has entered into a definitive agreement to acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), the two companies' 50-50 joint venture serving the global semiconductor and wafer polishing industries. Terms of the agreement were not disclosed. DA NanoMaterials manufactures chemical mechanical planarization (CMP) slurries for the semiconductor and wafer polishing...

SHANGHAI and CAMBRIDGE, United Kingdom, Feb. 27, 2012 /PRNewswire-Asia/ -- Brite Semiconductor (Shanghai) Corporation, a leading IC design and turnkey service provider, Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 0981.HK), and ARM today jointly announced the first tape out of a dual-core ARM(®) Cortex(TM)-A9 MPCore(TM) test chip using SMIC's 40nm low leakage process technology. The test chip is an implementation of a dual-core Cortex-A9...

ALBANY, New York, February 27, 2012 /PRNewswire/ -- New Report Added in ResearchMoz Reports Database Cost and Price of China Solar Polysilicon Ingot Wafer Cell Module 2012 Deep Research Report [http://www.researchmoz.com/cost-and-price-of-china-solar-polysilicon-ingot-wafer-cell-module-2012-deep-research-report-report.html ] 2012 Deep Research Report on Cost and Price of China Solar Polysilicon Ingot Wafer Cell Module> was a professional Cost and price Profit deep...