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Latest Wafer Stories

2012-10-25 07:26:00

ST. PETERS, Mo., Oct. 25, 2012 /PRNewswire/ -- MEMC Electronic Materials, Inc. (NYSE: WFR) invites investors to listen to a broadcast of the Company's conference call to discuss third quarter 2012 financial results. The live webcast will take place on Wednesday, November 7, 2012 at 8:00 a.m. Eastern Time at www.memc.com. Participating in the call will be Ahmad Chatila, Chief Executive Officer, and Brian Wuebbels, Chief Financial Officer. A replay of the call will be available until 11:59...

2012-10-23 07:35:05

SAN JOSE, Calif., Oct. 23, 2012 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced its new in-line wafer inspection system, the Superfast 3G, which provides the flexibility to address a wide range of applications including improved overlay control and enhanced yield. The system has the flexibility to be implemented anywhere...

2012-10-23 07:33:00

SHANGHAI, Oct. 23, 2012 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) today was recognized by the China Semiconductor Industry Association (CSIA) and other industry trade groups as one of "China's Top 10 Excellent Semiconductor Enterprises" during an event at the Tenth China International Semiconductor Exhibition and Forum ("IC China") celebrating the industry's past ten years of progress. The award was given to ten Chinese...

2012-10-22 07:33:02

TEMPE, Ariz., Oct. 22, 2012 /PRNewswire/ -- ProTek Devices(TM) today announced a new business line currently targeted at LED lighting manufacturers. The product line consists of individual unpackaged die available in wafer form. The die in wafer form are available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes. ProTek Devices' new LED die solutions meet various LED lamp manufacturing needs. In addition to LED lighting manufacturers, other...

2012-10-16 11:27:02

AUSTIN, Texas, Oct. 16, 2012 /PRNewswire/ -- ePAK International, Inc. announced today that it has filed a lawsuit in California against TexChem Advanced Packaging Products alleging infringement of ePAK's patent related to its line of eLX(TM) Zero-Movement semiconductor wafer handling and transport canisters. ePAK has asserted that TexChem's 300mm HWS-RM Horizontal WaferShipper(TM) infringes ePAK's US Patent 6,988,620 entitled "Container With an Adjustable Inside Dimension That Restricts...

2012-10-12 03:20:54

HSINCHU, Taiwan, R.O.C., Oct. 12, 2012 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today announced that it has taped out the foundry segment's first CoWoS((TM) )(Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface. The milestone demonstrates the industry's system integration trend to achieve increased bandwidth, higher performance and superior energy efficiency. This new generation of TSMC's CoWoS((TM)) test vehicles...

2012-10-09 11:29:06

BERNIN, France, October 9, 2012 /PRNewswire/ -- New Agreement Expands Global SOI Wafer Supply To Meet Growing Market Demand In Consumer Applications Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shin-Etsu Handotai Co., Ltd (SEH), the world leader in the manufacturing of silicon wafers today announced a Smart Cut(TM) licensing extension and expanded technology...

2012-10-09 07:35:12

ST. FLORIAN, Austria, Oct. 9, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed an EVG850LT 300-mm, low-temperature automated production bonding system for silicon-on-insulator (SOI) materials. The China-U.S. joint-venture SOI wafer provider selected the 300-mm bonder as a follow-on to its prior...

2012-10-09 03:21:12

NEWPORT, United Kingdom, Oct. 9, 2012 /PRNewswire/ -- SEMICON Europa -- SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that it has signed a JDP Program with ASSID from Fraunhofer-IZM to research sub-175 degrees C dielectric films in through silicon vias (TSV) for 3D-IC packaging. The program will use 300mm APM plasma enhanced chemical vapor deposition (PECVD) modules installed on a Versalis(®)...

Semiconductor Etching With Light
2012-09-29 05:28:50

redOrbit Staff & Wire Reports - Your Universe Online Researchers at one US university have developed a new, low-cost method of etching minute features onto semiconductor wafers while monitoring the process as it happens. University of Illinois electrical and computer engineering professor Gabriel Popescu and colleagues say that their method allows chipmakers to use a special microscope that uses two beams of light to precisely measure the topography. Their technique allows...