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Latest Wafer Stories

2014-07-04 23:02:40

The market report is a culmination of an extensive primary and secondary research that provides the current size of the market (both in terms of the shipments and market revenue) and also forecasts the same for the period from 2014 to 2020. (PRWEB) July 04, 2014 According to a new market research report, "Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography - Analysis &...

2014-07-03 12:27:55

MIGDAL HAEMEK, Israel, July 3, 2014 /PRNewswire/ -- Jordan Valley Semiconductors Ltd. [http://www.jordanvalley.com [https://webmail.jvsemi.com/exchweb/bin/redir.asp?URL=http://www.jordanvalley.com ]], a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (microXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by...

2014-07-02 08:22:49

- Up to 0.25% efficiency gains demonstrated on 110 ohms/sq. monocrystalline wafers WEST CONSHOHOCKEN, Pa., July 2, 2014 /PRNewswire/ -- The Heraeus Photovoltaics Business Unit will feature two new front-side metallization pastes for c-Si solar cells during the Intersolar North America 2014 at the Moscone Center in San Francisco, California on level 1 in Booth 7611 from July 8(th) through 10(th). The SOL9620 Series and SOL9621 Series represent Heraeus' latest pastes that enable cell...

2014-06-30 08:37:09

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput ST. FLORIAN, Austria, June 30, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI(®)FB XT--its next-generation fusion wafer bonding platform, which combines several performance...

2014-06-25 08:24:42

DUBLIN, June 25, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/6pbpzk/gallium_nitride) has announced the addition of the "2014 Report on the International Gallium Nitride (GaN) Semiconductor Devices (Discrete & IC) and Substrate Wafer Market - Forecast to 2022" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 This report concerning the GaN device and wafer market identifies the entire market and all its sub-segments...

2014-06-13 20:23:17

DUBLIN, June 13, 2014 /PRNewswire/ -- Research and Markets ( http://www.researchandmarkets.com/research/b2pgb7/power_electronics) has announced the addition of the "Power Electronics Market by Substrate Wafer Technology, Devices, Applications, and Geography - Analysis & Forecast to 2014 - 2020" [http://www.researchandmarkets.com/research/b2pgb7/power_electronics ] report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) Power...

2014-06-13 08:26:01

NEW TAIPEI CITY, June 13, 2014 /PRNewswire/ -- Kingyoup Optronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D...

2014-06-09 08:36:32

PHOENIX, June 9, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted Tessier, will be presenting a collaborative paper with Fujikura Limited entitled "Enabling Wearable Electronics: Innovation Through Miniaturization" at the TechSearch International Packaging and Assembly Considerations in Wearable Electronics Workshop to be held in Austin, Texas on June 11(th) and 12(th),...

2014-06-03 12:34:01

Tiny self-assembling tools could one day deliver drugs to targeted areas of the body or even perform autonomous microsurgery WASHINGTON, June 3, 2014 /PRNewswire-USNewswire/ -- Researchers from the University of Twente in the Netherlands have taken the precise art of origami down to the microscopic scale. Using only a drop of water, the scientists have folded flat sheets of silicon nitride into cubes, pyramids, half soccer-ball-shaped bowls and long triangular structures that...

2014-06-03 12:28:39

SAN JOSE, Calif., June 3, 2014 /PRNewswire/ -- D2S®, a supplier of computational design platforms based on eBeam and general purpose graphic processing unit (GPGPU) technologies, today announced that it has acquired all assets of Gauda, Inc., a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale, Calif. The acquisition, which includes all of Gauda's patents related to GPGPU acceleration as well as software, will strengthen D2S'...


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omadhaun
  • A fool; a simpleton: a term of abuse common in Ireland and to a less extent in the Gaelic-speaking parts of Scotland.
This word is partly Irish in origin.