Microsemi Announces New 1.7KW RF Generator Reference Design Kit
IRVINE, Calif., May 6, 2008 (PRIME NEWSWIRE) — Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, has announced a 1.7KW, Push Pull, Class-D reference design kit that enables RF design engineers to immediately evaluate a highly efficient, high power, Class-D amplifier.
Based on Microsemi’s DRF1300 Driver/MOSFET hybrid, the new reference design kit provides an essential tool in developing high-power, high-voltage RF generators, optimizing efficiency and power densities for plasma generation, switch mode power amplifiers, pulse generators, ultrasound transducer drivers and acoustical optical modulators.
* Greater than 1700 Watts Output Power * Better than 80% Efficient Class-D Operation * 13.56 MHz Switching Frequency * Up to 250 Supply Voltages * Internal MOSFET Rated at 500V BV(DSS) * Low Cost System Design * Solid State Transition for Tube Amplifiers
Class-D amplifiers offer a degree of efficiency unavailable with linear designs. Many engineers, however, avoid the complexities of Class-D amplifier designs — or are forced to spend months acquiring its fundamentals. Now, with Microsemi’s new DRF1300/Class-D reference design kit, engineers can rapidly overcome the pitfalls of high voltage Class-D design, saving months of designer time and countless design iterations.
Using Microsemi’s DRF1300 Driver/MOSFET hybrid as its core, the kit’s reference board enables performance levels previously unachievable with solid state Class-D amplifiers. The DRF1300 hybrid combines two drivers, two high voltage MOSFETs and internal bypass capacitors in a push pull configuration making it a highly efficient, high voltage, cost effective solution. The drivers combined with optimally located bypass capacitors are capable of driving the high voltage MOSFETs at more than 30MHz. The 500V MOSFET enables high voltage applications, greatly simplifying output matching and reducing complexity of the output combining networks.
The new Microsemi Class-D reference design kit includes a designer’s application note discussing the progression through various output voltages, while identifying proper output waveforms necessary for safe transition to greater than 1700 watts into a 50 Ohm load. It also demonstrates how to achieve efficiencies higher than 90% at sub 1KW outputs. It demonstrates supply bypassing and building the high power magnetics required for high power Class-D designs. The board comes fully assembled and is mounted to a machined heatsink.
The Class-D reference design kit is extremely versatile. After evaluating a design with the preloaded 500V, 30A DRF1300 hybrid, applications can be modified for higher voltage requirements by using the 1000V, 15A DRF1301 Driver/MOSFET hybrid.
The DRF1300 hybrid features an air cavity-flangeless package for improved reliability over plastic encapsulated packaging. Constructed with materials with closely matched CTEs the flangeless package maximizes system reliability by alleviating the stress between components during power cycling. Typical applications have demonstrated in excess of 1 million cycles with power densities of 700 Watts/square inch. The flangeless package design also reduces cost, eliminating expensive copper tungsten flanges that are typical in conventional high power RF packages.
DRF1300/Class-D reference design kits are available now, with a unit price of $1600. Samples of the DRF1300 and DRF1301 Driver/MOSFET hybrids are also available now. Additional DRF1300 hybrids are available for a unit price of $225.00 in 100 piece quantities. All devices are available through the factory or from authorized distributors of Microsemi RF products.
About Microsemi Corporation
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company’s semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi’s products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance, reliability and battery optimization, reducing size or protecting circuits. The principal markets the company serves include implantable medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com.
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Investor Inquiries: Robert C. Adams, Microsemi Corporation, Irvine, CA (949) 221-7100.
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CONTACT: Microsemi Corporation Financial Contact: John W. Hohener, Vice President and CFO (949) 221-7100 Investor Relations: Robert C. Adams, Vice President Business Development & Investor Relations (949) 221-7100